| Doc# |
Title |
Revision Date |
| IPC-2221 |
Generic Standard on Printed Wiring Board Design |
2/1/1998 |
| IPC-2222 |
Sectional Standard on Rigid Printed Wiring Board Design |
2/1/1998 |
| IPC-2223A |
Sectional Design Standard for Flexible Printed Boards - Supersedes IPC-D-249 |
6/1/2004 |
| IPC-2225 |
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
5/1/1998 |
| IPC-6011 |
Generic Performance Specifications for Printed Boards |
7/1/1996 |
| IPC-6012A |
Qualification and Performance Specification for Rigid Printed Boards |
10/1/1999 |
| IPC-6013A |
Qualification and Performance Specification for Flexible Printed Boards - Amendment 1: 1/2005 |
11/1/2003 |
| IPC-6015 |
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures |
2/1/1998 |
| IPC-6018 |
Microwave End Product Board Inspection and Test - HF-318B; Supersedes HF-318A December 1991 |
1/1/2002 |
| J-STD-004 |
Requirements for Soldering Fluxes - Replaces QQ-S-571: 1994; Amendment 1 - April 1996 |
1/1/1995 |
| J-STD-005 |
Requirements for Soldering Pastes; Amendment 1 - June 1996 |
1/1/1995 |
| J-STD-006 |
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
5/1/2001 |
| NASA-HDBK 8739.21 |
Electrostatic Discharge (ESD) Control |
6/18/2010 |