Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures

This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic Single-chip Module (SCM-L) or Organic Multichip Module (MCM-L) assembly, and the quality and reliability assurance requirements that must be met for their acquisition. The requirements contained herein are intended to reflect the electrical, mechanical, and environmental properties of the MCM-L mounting structure.

Document ID 
IPC-6015
Related Topics 
Workmanship