This standard is intended to provide information on the detailed requirements for organic Laminated Multichip Module (MCM-L) design. All aspects and details of the design requirements are addressed to the extent that they can be applied to the unique requirements of those designs that use organic rigid (reinforced), organic flexible (unreinforced) materials or organic materials in combination with inorganic materials (metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting unpackaged die. The information contained herein is intended to supplement generic design requirements identified in IPC-2221. When coupled with the generic design input, it should facilitate the selection process of the materials and the detailed organic structure fabrication technology necessary to meet the engineering design objectives.