This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered. The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and attach passive and active components. This standard is not intended for use as a performance specification for finished boards nor as an acceptance document for electronic assemblies. For acceptability requirements of electronic assemblies, see IPC/EIA-J-STD-001 and IPC-A-610. The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die. The materials may be any combination able to perform the physical, thermal, environmental, and electronic function.